Practices in Data Center Chip Design

At ISCAS 2026, Xia Jing, Huawei Fellow, uncovered the future of data center chip design in his presentation entitled "Practices of Data Center Chip Design: Tau Scaling Engineering Choices and Trade-Offs". He examined Tau (τ) Scaling Law's LogicScaling Path—from System to Chip to Circuit—and highlighted how innovation increasingly requires coordinated advances across multiple levels of architecture and design as well as the evolution of the Kunpeng 960 roadmap. Learn more about the Tau (τ) Scaling Law: https://bit.ly/3QeRdNX #HUAWEI #Innovation #Chipset #DataCenter #Semiconductors